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RISImpact of UHPC Tensile Behavior on Steel Reinforced UHPC Flexural Behavior
Publisher: ASCE
Abstract: Ultrahigh-performance concrete (UHPC) typically contains short steel fibers with a fiber volume of 2% or larger. This relatively high fiber volume leads to high UHPC tensile strength, typically larger than 8 MPa, and ...
Submodeling Analysis for Path-Dependent Thermomechanical Problems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a finite element analysis, when localized behavior of a large model is of particular concern, generally one would refine the mesh until it captures the local solution adequately. Submodeling ...
Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to cost and process considerations, sometimes a drop-in heat spreader is incorporated in a quad flat package, which is not attached to the die pad. Consequently, due to mismatch of thermal ...
Design Guideline for Ball Impact Test Apparatus
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that ...
Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn–3Ag–1.5Cu∕Sn–3Ag–0.5Cu composite flip-chip solder joints with Ti∕Ni(V)∕Cu under bump metallurgy (UBM), bonded on ...
Relationship between Morphological Characteristics and Land-Use Intensity: Empirical Analysis of Shanghai Development Zones
Publisher: American Society of Civil Engineers
Abstract: In recent years, macro- and mesoresearches on urban morphology have started, but microscopic morphology of development zones is still a neglected area. In this paper, the GIS spatial analysis method is used to undertake ...
Improving the Ductility of Concrete Beams Reinforced with Topologically Optimized Steel
Publisher: American Society of Civil Engineers
Abstract: To address the sustainability challenges faced by concrete structures, various attempts have been made to optimize the reinforcement layout with a topologically optimized strut-and-tie model (STM). However, most studies ...
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Plane two-dimensional finite element analysis was applied to study the effect of underfill thermomechanical properties on the potential of thermal fatigue failure for flip-chip ball grid array. ...
Effect of Test Conditions on Electromigration Reliability of Sn–Ag–Cu Flip-Chip Solder Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue ...
Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We present in this paper parametric studies of board-level reliability of wafer-level chip-scale packages subjected to a specific pulse-controlled drop test condition. Eighteen experiment cells, ...