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Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The design of three-dimensional (3D) power delivery network (PDN) is constrained by both power and thermal integrity. Through-silicon via (TSV) as an important part of transmission power and heat in stack, the rational ...
Mechanical Magnetic Coupling Analysis of a Novel Large Stroke Penta Stable Mechanism Possessing Multistability Transforming Capability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Considering the nonlinear mechanicalmagnetic coupling effects, an accurate mathematical model was established for analyzing large stroke pentastable mechanism possessing multistability transforming capability, with which ...