Abstract: Liquid film boiling, where bubbles are generated together with evaporation in several hundred micrometers thick liquid film, has attracted great interest recently due to its potential in dissipating high heat flux with low ...

Abstract: Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available ...

Abstract: Thermal ground planes (TGPs) are passive thermal management devices that utilize the phase-change of a working fluid to achieve high thermal conductivity and low thermal resistance. TGPs are flat, two-dimensional heat ...