Abstract: This paper presents an integrated power electronics module with a vapor chamber (VC) acting as a heat spreader to transfer the heat from the insulated gate bipolar transistor (IGBT) module to ...

Abstract: A novel Hencky bar-grid model (eHBM) was developed to address plane stress elasticity problems. This model comprises rigid bars arranged in a grid which are joined by frictionless hinges, frictionless pulleys, elastic ...