YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-4 of 4

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study 

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001:;page 40
    Author(s): D. Pal; Y. K. Joshi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A computational model is developed to predict the performance of phase change materials(PCMs) for passive thermal control of electronic modules during transient power variations or following an ...
    Request PDF

    Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure 

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002:;page 108
    Author(s): L. Tang; Y. K. Joshi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the present paper, a methodology is described for the integrated thermal analysis of a laminar natural convection air cooled nonventilated electronic system. This approach is illustrated by ...
    Request PDF

    Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004:;page 294
    Author(s): D. Mukutmoni; Y. K. Joshi; M. D. Kelleher
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A computational study of natural convection in an enclosure as applied to applications in cooling of electronic components is reported. The investigation is for a configuration consisting of a ...
    Request PDF

    Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001:;page 63
    Author(s): X. J. Wei; Y. K. Joshi; P. M. Ligrani
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50×10−6m(50μm) deep and 200×10−6m(200μm) ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian