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Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
 Publisher: The American Society of Mechanical Engineers (ASME)
 Abstract: A  computational  model  is  developed  to  predict  the  performance  of  phase  change  materials(PCMs)  for  passive  thermal  control  of  electronic  modules  during  transient  power  variations  or  following  an  ...
Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure
 Publisher: The American Society of Mechanical Engineers (ASME)
 Abstract: In  the  present  paper,  a  methodology  is  described  for  the  integrated  thermal  analysis  of  a  laminar  natural  convection  air  cooled  nonventilated  electronic  system.  This  approach  is  illustrated  by  ...
Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity
 Publisher: The American Society of Mechanical Engineers (ASME)
 Abstract: A  computational  study  of  natural  convection  in  an  enclosure  as  applied  to  applications  in  cooling  of  electronic  components  is  reported.  The  investigation  is  for  a  configuration  consisting  of  a ...
Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
 Publisher: The American Society of Mechanical Engineers (ASME)
 Abstract: Steady,  laminar  flow  and  heat  transfer,  inside  a  rectangular  microchannel  with  a  dimpled  bottom  surface,  are  numerically  studied.  The  microchannel  is  50×10−6m(50μm)  deep  and  200×10−6m(200μm) ...
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