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RISBehavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The contact resistances investigated by this study of ACF joints using Au∕Ni bumps and flexible substrates are found to be increased by the induced mechanical shock and also by the combined ...
Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents the reliability of anisotropic conductive film (ACF) joint tested under reflow soldering and environmental test effect. The ACF joint behaved differently under different reflow ...
An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Intermetallics formation between metallization conductor Pd-Ag and solder 62Sn-36Pb-2Ag have been investigated by transmission electron microscopy (TEM) and X-Ray diffraction. Energy-dispersive X-Ray ...
Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Generally, adhesive materials can be cured in a short time under high curing temperature. High curing temperature usually leads to an increase in cross-link density and a homologous increase ...
Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In anisotropic conductive adhesive (ACA) interconnections, the particles are electrical conductors providing current paths in the fine pitch electronic packaging as well as physical parts connecting ...
The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, the diffusion behavior and microstructural evolution of Cu-Sn intermetallics at eutectic Sn-Pb solder/copper substrate interface of PBGA solder joints was studied. The PBGA solder ...
Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The shear cycle fatigue lifetimes of plastic ball grid array (PBGA) solder joints formed using different reflow profiles are studied in this paper. The profiles were devised to have the same ...
Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The application of underfill materials to fill up the room between the chip and substrate is known to substantially improve the thermal fatigue life of flip chip solder joints. Nowadays, no-flow ...
Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Sn-based, Pb-free solders with high a Sn content and high melting temperature often cause excessive interfacial reactions at interfaces. Sn-3.5Ag solder alloy has been used to identify its ...
Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip chip is the emerging interconnect technology for the next generation of high performance electronics. To eliminate the process bottlenecks associated with flip chip assembly, a new assembly ...