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RISUnidirectional Wave Motions
Publisher: The American Society of Mechanical Engineers (ASME)
Dynamic Bending Strains in Planar Trusses with Pinned or Rigid Joints
Publisher: American Society of Civil Engineers
Abstract: The method of reverberation ray matrix is applied to analyze the dynamic behavior of structural members in trusses with pinned joints subjected to suddenly applied force. The results are compared with those in planar trusses ...
Nonlinear Flexural Vibrations of a Clamped Circular Plate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Nonlinear flexural vibration of a circular plate clamped at its edge are investigated both experimentally and theoretically. The investigation has been restricted to the first axisymmetric mode. ...
Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
The Influence of the Curvature of Spherical Waves on Dynamic Stress Concentration
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: From a study of scattering of spherical compressional waves by a spherical cavity in an elastic solid, the dynamic stresses on the surface of the cavity are computed and compared with those ...
Discussion: “Application of Kirchhoff’s Integral Equation Formulation to an Elastic Wave Scattering Problem” (Ko, W. L., and Karlsson, T., 1967, ASME J. Appl. Mech., 34, pp. 921–930)
Publisher: The American Society of Mechanical Engineers (ASME)
Seismic Migration—Imaging of Acoustic Energy by Wave Field Extrapolation
Publisher: The American Society of Mechanical Engineers (ASME)
Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C ...
Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The application of Ball Grid Array (BGA) technology in electronic packaging on high I/O plastic and ceramic packages has grown significantly during the past few years. Although PBGA (plastic ...
Vibration Mode Analysis of Frames by the Method of Reverberation Ray Matrix
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The method of reverberation ray matrix (MRRM) has been developed by (1999, “ Dynamic Response and Wave Propagation in Plane Trusses and Frames,” AIAA J., 37(5), pp. 594–603) recently based on ...