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    Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 002:;page 150
    Author(s): X. Yan; R. K. Agarwal
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Two test specimens are developed to measure interfacial fracture toughness in flip-chip assemblies. The specimens consist of three layers: silicon chip, underfill, and circuit board. Two symmetric ...
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    Aerodynamic Design, Model Test, and CFD Analysis for a Multistage Axial Helium Compressor 

    Source: Journal of Turbomachinery:;2008:;volume( 130 ):;issue: 003:;page 31018
    Author(s): X. Yan; H. Itaka; K. Takahashi; T. Takizuka; K. Kunitomi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Results of an aerodynamic design study for the multistage axial helium compressor of a 300 MWe class nuclear gas turbine are presented. Helium compressor aerodynamics is challenged by the ...
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    Evaluation and Improvement of Productivity in High-Speed NC Machining 

    Source: Journal of Manufacturing Science and Engineering:;2000:;volume( 122 ):;issue: 003:;page 556
    Author(s): X. Yan; K. Shirase; M. Hirao; T. Yasui
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The productivity of machining centers is influenced inherently by the quality of NC programs. To evaluate productivity, first an effective feedrate factor and a productivity evaluation factor are ...
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    Automated Fatigue Data Fitting Using Structural Shift Detection 

    Source: Journal of Engineering Materials and Technology:;1997:;volume( 119 ):;issue: 001:;page 51
    Author(s): J. H. Vogel; T. S. Cordes; P. M. Dindinger; X. Yan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A set of data fitting algorithms are presented for determining the cyclic material properties used in the local strain approach to fatigue life prediction. These properties are obtained by ...
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