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    Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 002:;page 177
    Author(s): X. J. Xin; Z. J. Pei; Wenjie Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required ...
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    Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002:;page 189
    Author(s): X. K. Sun; Z. J. Pei; X. J. Xin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents an assessment of four die-strength testing configurations using finite element analysis. The simulation indicates that ring-on-ring configuration is the best because it generates ...
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    Study on Edge Chipping in Rotary Ultrasonic Machining of Ceramics: An Integration of Designed Experiments and Finite Element Method Analysis 

    Source: Journal of Manufacturing Science and Engineering:;2005:;volume( 127 ):;issue: 004:;page 752
    Author(s): Yue Jiao; W. J. Liu; Z. J. Pei; X. J. Xin; C. Treadwell
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Advanced ceramics have found a variety of engineering applications, thanks to their superior properties (such as high hardness and strength at elevated temperatures; chemical inertness; high wear ...
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