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Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required ...
Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an assessment of four die-strength testing configurations using finite element analysis. The simulation indicates that ring-on-ring configuration is the best because it generates ...
Study on Edge Chipping in Rotary Ultrasonic Machining of Ceramics: An Integration of Designed Experiments and Finite Element Method Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Advanced ceramics have found a variety of engineering applications, thanks to their superior properties (such as high hardness and strength at elevated temperatures; chemical inertness; high wear ...
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