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    Convective Heat Transfer Distribution on the Surface of an Electronic Package 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001:;page 49
    Author(s): R. A. Wirtz; Ashok Mathur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Measurements of the distribution of convective heat transfer over the five exposed faces of a low profile electronic package are described. The package, of square planform and length-to-height ...
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    A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001:;page 1
    Author(s): Ning Zheng; R. A. Wirtz
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A thermal response model for designing a hybrid thermal energy storage (TES) heat sink is developed. The stabilization time and maximum operating (hot side) temperature-to-transition temperature ...
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    Laminar-Transitional Convection From Repeated Ribs in a Channel 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001:;page 29
    Author(s): R. A. Wirtz; Weiming Chen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Velocimetry, heat transfer, and pressure drop experiments are reported for laminar/transitional air flow in a channel containing rectangular transverse ribs located along one channel wall. The ...
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    A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001:;page 8
    Author(s): Ning Zheng; R. A. Wirtz
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Two figures of merit for hybrid Thermal Energy Storage (TES) units are developed: the volumetric figure of merit, Ṽ, and the temperature control figure of merit, ΔT̃. A dimensional analysis ...
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    In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003:;page 353
    Author(s): Jun Xu; Richard A. Wirtz
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Algebraic models of porosity, specific surface area, and in-plane effective thermal conductivity for stacked, two-dimensional symmetric diamond-weave screen laminations are developed and benchmarked ...
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    Flow-Through Boiling of Isopentane in Structured-Porous Fins: Effects of System Parameters 

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 007:;page 71501
    Author(s): Zenghui Zhao; Richard A. Wirtz
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Metallic porous structures have proved to be effective in enhancing heat transfer due to the inherent characteristics such as high specific surface area and large pore densities. In this study, ...
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    The Effect of Variations in Stream-Wise Spacing and Length on Convection From Surface Mounted Rectangular Components 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001:;page 26
    Author(s): G. L. Lehmann; R. A. Wirtz
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The effect of variations in stream-wise spacing and component length on convection from rectangular, surface mounted components in a channel flow are reported. Component dimensions are the same ...
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    Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003:;page 206
    Author(s): R. A. Wirtz; Weiming Chen; Ronghua Zhou
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Heat transfer experiments are reported on the thermal performance of longitudinal fin heat sinks attached to an electronic package which is part of a regular array of packages undergoing forced ...
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    Experimental Modeling of Convection Downstream from an Electronic Package Row 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003:;page 207
    Author(s): R. A. Wirtz; W. McAuliffe
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experiments on convective heat transfer in the wake of a row of closely spaced pin-mount packages are reported. Flow visualization and interferometric heat transfer measurements are made in an ...
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    Comparison of the Cooling Performance of Staggered and In-Line Arrays of Electronic Packages 

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001:;page 27
    Author(s): R. A. Wirtz; D. M. Colban
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The cooling performance of in-line and staggered regular arrays of simulated electronic packages is compared for both sparse and dense packaging configurations. At equal flow rates, staggered ...
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