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An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Moisture induced epoxy swelling is a potential failure mechanism in nonhermetic packages. Epoxy materials used in the package absorb moisture and swell in a relatively humid environment. This ...
Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a performance study done on a semiconductor laser diode in a moisture condensing environment. Devices with laser diodes are used in a wide variety of electronic applications ...