Abstract: Thermal fatigue failure of microelectronic chip often initiates from the interface between solder and substrate, and the service life of the chip is largely dependent on the singular stress–strain at this interface. To ...

Abstract: To clearly clarify the effects of different upstream boundary layer thickness and tip clearance size to the detailed tip flow field and flow mechanism, numerical simulations are performed on a subsonic compressor rotor, ...

Abstract: Owing to the manufacturing and assembly error or the fatigue of long-time operation, nonaxisymmetric tip clearance is actually a common phenomenon in compressors. It is also well accepted that tip leakage flow, associated ...

Abstract: Figures 12 and 13 on page 6 of the original manuscript contain some errors. The correct figures are as follows:

Abstract: This paper discusses detailed experimental studies of a lowspeed largescale axial compressor, which is typical of an exit stage of HPC. Numerous measuring techniques were performed, and detailed experimental results were ...

Abstract: Lowspeed model testing (LSMT) plays a key role in advanced multistage highpressure compressor (HPC) design recently, due to this, employing lowspeed largescale compressor to conduct 3D blading design and detailed flow ...

Abstract: Microstructures determine flow properties of microfluidic chip. Micromold forming is an effective method to realize mass manufacturing of microfluidic chips. This requires to machine some kind of special microstructure of ...