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Polygonal Droplets on Microstructured Surfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Photogallery Entry 6
Modeling and Optimization of Superhydrophobic Condensation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Superhydrophobic micro/nanostructured surfaces for dropwise condensation have recently received significant attention due to their potential to enhance heat transfer performance by shedding water droplets via coalescenceinduced ...
Ostwald Ripening During Freezing on Scalable Superhydrophobic Surfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Photogallery Entry 1
Jumping Droplet Electrostatic Charging and Effect on Vapor Drag
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Photogallery Entry 9
Suppressed Dry out in Two Phase Microchannels via Surface Structures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We demonstrated suppressed dryout on structured surfaces during flow boiling in microchannels. We designed and fabricated microchannels with welldefined silicon micropillar arrays (heights of ~25 آµm, diameters of 10 آµm ...
Condensation on Superhydrophobic Copper Oxide Nanostructures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Condensation is an important process in both emerging and traditional power generation and water desalination technologies. Superhydrophobic nanostructures promise enhanced condensation heat transfer by reducing the ...
Visualization of the Evaporating Liquid Vapor Interface in Micropillar Arrays
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We captured interesting static and dynamic behavior of the liquidvapor interface in welldefined silicon micropillar arrays during thermally driven evaporation of water from the microstructured surface. The 3D shape of the ...
Controlled Wetting in Nanoporous Membranes for Thin Film Evaporation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the ever increasing cooling demands of advanced electronics, thin film evaporation has emerged as one of the most promising thermal management solutions. High heat transfer rates can be achieved in thin films of liquids ...
Development and Characterization of an Air Cooled Loop Heat Pipe With a Wick in the Condenser
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal management of modern electronics is rapidly becoming a critical bottleneck of their computational performance. Aircooled heat sinks offer ease and flexibility in installation and are currently the most widely used ...
Surface Structure Enhanced Microchannel Flow Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We investigated the role of surface microstructures in twophase microchannels on suppressing flow instabilities and enhancing heat transfer. We designed and fabricated microchannels with welldefined silicon micropillar ...