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RISReliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very ...