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    Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 001:;page 11006
    Author(s): Yung-Shin Tseng; Tzu-Chen Hung; Bau-Shei Pei
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found ...
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    A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004:;page 523
    Author(s): S. Kong Wang; Bau-Shi Pei; An-Fong Chen; Ja-Lin Du; Tzu-Chen Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Two-dimensional convection heat transfer on a chip with a flow-disturbing obstruction block above it, as induced by natural coupling between flow and structure, was investigated numerically. The ...
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    Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003:;page 348
    Author(s): Yen-Shu Chen; Kuo-Hsiang Chien; Tzu-Chen Hung; Yuh-Ming Ferng; Bau-Shei Pei; Chi-Chuan Wang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study examines the spreading ability of rectangular plates numerically, analytically, and experimentally. The effect of aspect ratio, defined as an equivalent radius of a heater divided by ...
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