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Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found ...
A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two-dimensional convection heat transfer on a chip with a flow-disturbing obstruction block above it, as induced by natural coupling between flow and structure, was investigated numerically. The ...
Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study examines the spreading ability of rectangular plates numerically, analytically, and experimentally. The effect of aspect ratio, defined as an equivalent radius of a heater divided by ...