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    Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41101-1
    Author(s): Gharaibeh, Ahmad R.; Soud, Qusai; Manaserh, Yaman; Tradat, Mohammad; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed ...
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    Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 003:;page 31015-1
    Author(s): Tradat, Mohammad I.; Manaserh, Yaman “Mohammad Ali”; Gharaibeh, Ahmad; Sammakia, Bahgat G.; Hall, Dave; Nemati, Kourosh; Seymour, Mark
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, Although, both are centrifugal blowers. The blade design ...
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    Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles 

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001:;page 10907
    Author(s): Khalili, Sadegh; Tradat, Mohammad I.; Nemati, Kourosh; Seymour, Mark; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In raised floor data centers, tiles with high open area ratio or complex understructure are used to fulfill the demand of today's high-density computing. Using more open tiles reduces the pressure drop across the raised ...
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    Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41117-1
    Author(s): Shahi, Pardeep; Heydari, Ali; Eslami, Bahareh; Radmard, Vahideh; Hinge, Chandraprakash; Modi, Himanshu; Chinthaparthy, Lochan Sai Reddy; Tradat, Mohammad; Agonafer, Dereje; Rodriguez, Jeremy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ...
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    Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41102-1
    Author(s): Heydari, Ali; Gharaibeh, Ahmad R.; Tradat, Mohammad; Soud, Qusai; Manaserh, Yaman; Radmard, Vahideh; Eslami, Bahareh; Rodriguez, Jeremy; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly ...
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    Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41106-1
    Author(s): Heydari, Ali; Soud, Qusai; Tradat, Mohammad; Gharaibeh, Ahmad R.; Fallahtafti, Najmeh; Rodriguez, Jeremy; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As web-based AI applications are growing rapidly, server rooms face escalating computational demands, prompting enterprises to either upgrade their facilities or outsource to co-located sites. This growth strains conventional ...
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    A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004:;page 41015-1
    Author(s): Mohsenian, Ghazal; Hoang, Cong Hiep; Nemati, Kourosh; Alissa, Hussam; Tradat, Mohammad; Fallahtafti, Najmeh; Radmard, Vahideh; Murray, Bruce; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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