Abstract: In a finite element analysis, when localized behavior of a large model is of particular concern, generally one would refine the mesh until it captures the local solution adequately. Submodeling ...

Abstract: Due to cost and process considerations, sometimes a drop-in heat spreader is incorporated in a quad flat package, which is not attached to the die pad. Consequently, due to mismatch of thermal ...

Abstract: Plane two-dimensional finite element analysis was applied to study the effect of underfill thermomechanical properties on the potential of thermal fatigue failure for flip-chip ball grid array. ...

Abstract: In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient ...

Abstract: The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, was performed in this work to investigate ...