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RISA Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A detailed model of a die-up 256-pin Plastic Ball Grid Array (PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, ...
Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The latest commercial applications for microelectronics use GaAs material for RF power amplifier (PA) devices. This leads to the necessity of identifying low cost packaging solutions with high ...
Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increasing trend in power levels and associated densities leads to the need of design thermal optimization, either at the module level or at the system (module-board stack-up) level. The ...