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    A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004:;page 460
    Author(s): Karan Kacker; Wansuk Yun; Suresh K. Sitaraman; Madhavan Swaminathan; Thomas Sokol
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Demand for off-chip bandwidth has continued to increase. It is projected by the Semiconductor Industry Association in their International Technology Roadmap for Semiconductors that by the year ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian