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    From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 001:;page 11004
    Author(s): Thomas J. Breen; Jeff Punch; Amip J. Shah; Cullen E. Bash; Ed J. Walsh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: To achieve reductions in the power consumption of the data center cooling infrastructure, the current strategy in data center design is to increase the inlet temperature to the rack, while the ...
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    From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 003:;page 31008
    Author(s): Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash; Thomas J. Breen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The chiller cooled data center environment consists of many interlinked elements that are usually treated as individual components. This chain of components and their influences on each other ...
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    From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiencyor1 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 004:;page 41006
    Author(s): Thomas J. Breen; Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash; Brandon Rubenstein; Scot Heath; Niru Kumari
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the drive to enhance data center energy efficiency, much attention has been placed on the prospect of airflow containment in hot-aisle cold-aisle raised floor arrangements. Such containment ...
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    From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 004:;page 41009
    Author(s): Thomas J. Breen; Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash; Niru Kumari; Tahir Cader
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The power consumption of the chip package is known to vary with operating temperature, independently of the workload processing power. This variation is commonly known as chip leakage power, ...
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    DSpace software copyright © 2002-2015  DuraSpace
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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