Abstract: Flip-chip bonding is a kind of chip packaging technology, which can make fabricated chips lighter and smaller. Thermo-ultrasonic flip-chip bonding is a technology that directly joins gold pad ...

Abstract: Engineering geological characterization, subject to spatial variability of soil properties, is a three-dimensional (3D) problem in reality, although it is often simplified as one- or two-dimensional. Direct characterization ...

Abstract: Magnetorheological elastomer (MRE) has great application prospects in the fields of shock absorption, isolation, sensing, and soft robots. However, the MRE precursor mixture cannot be printed directly due to its low viscosity ...