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    Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using H2O–Al2O3 Nanofluids 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002:;page 21008
    Author(s): T. L. Bergman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε-NTU heat exchanger methodology, and is used to ...
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    Extreme Plane Wall Midplane Temperatures Due to Sequential Heating and Cooling 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 009:;page 94503
    Author(s): T. L. Bergman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The thermal response of a one-dimensional plane wall to sequential heating and cooling is considered. Of interest is the thermal response at the midplane of the wall in terms of the extreme ...
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    Optimization of Plasma Spray Processing Parameters for Deposition of Nanostructured Powders for Coating Formation 

    Source: Journal of Fluids Engineering:;2006:;volume( 128 ):;issue: 002:;page 394
    Author(s): I. Ahmed; T. L. Bergman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: When nanostructured powder particles are used for thermal spray coatings, the retention of the original nanostructure that is engineered into the raw stock is a principal objective, along with ...
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    Effect of Nonuniform Stack Compression on Proton Exchange Membrane Fuel Cell Temperature Distributions 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 012:;page 122002
    Author(s): N. Fekrazad; T. L. Bergman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A three-dimensional model is used to predict the power output and internal temperature distribution of a small proton exchange membrane fuel cell stack. Of particular interest is the influence ...
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    Bipolar Plate Thermal Response to PEM Fuel Cell Stack Compressive Load 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 006:;page 64503
    Author(s): N. Fekrazad; T. L. Bergman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This technical brief reports new findings regarding the strong relationship between the temperature of the bipolar plates of a proton exchange membrane fuel cell stack and thermal conditions ...
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    Ball Grid Array Thermomechanical Response During Reflow Assembly 

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 004:;page 214
    Author(s): T. E. Voth; T. L. Bergman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The thermomechanical response of ball-grid array assemblies during reflow soldering is considered here. Experiments are performed to investigate the thermomechanical response of a representative ...
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    Small and Large Time Solutions for Surface Temperature, Surface Heat Flux, and Energy Input in Transient, One-Dimensional Conduction 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 010:;page 101302
    Author(s): A. S. Lavine; T. L. Bergman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper addresses one-dimensional transient conduction in simple geometries. It is well known that the transient thermal responses of various objects, or of an infinite medium surrounding such ...
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    Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004:;page 317
    Author(s): Y. S. Son; M. T. Hyun; T. L. Bergman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Reflow soldering with nitrogen injection is simulated. Soldering is performed in a process oven that is equipped with porous panel heaters through which air or nitrogen is introduced to the ...
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    A Detailed Thermal Model of the Infrared Reflow Soldering Process 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 001:;page 55
    Author(s): M. A. Eftychiou; T. L. Bergman; G. Y. Masada
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A thermal model of the infrared reflow soldering process is developed and sample predictions are reported. The model, which accounts for coupled radiation, mixed convection and conduction heat ...
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    Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001:;page 41
    Author(s): N. J. Fernandes; T. L. Bergman; G. Y. Masada
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental study has been conducted to reveal the relevant heat transfer mechanisms which exist within an infrared reflow oven. Simulated card assemblies are used and their transient thermal ...
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