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Analysis of Heat Transfer Enhancement in Minichannel Heat Sinks With Turbulent Flow Using H2O–Al2O3 Nanofluids
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε-NTU heat exchanger methodology, and is used to ...
Extreme Plane Wall Midplane Temperatures Due to Sequential Heating and Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal response of a one-dimensional plane wall to sequential heating and cooling is considered. Of interest is the thermal response at the midplane of the wall in terms of the extreme ...
Optimization of Plasma Spray Processing Parameters for Deposition of Nanostructured Powders for Coating Formation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: When nanostructured powder particles are used for thermal spray coatings, the retention of the original nanostructure that is engineered into the raw stock is a principal objective, along with ...
Effect of Nonuniform Stack Compression on Proton Exchange Membrane Fuel Cell Temperature Distributions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A three-dimensional model is used to predict the power output and internal temperature distribution of a small proton exchange membrane fuel cell stack. Of particular interest is the influence ...
Bipolar Plate Thermal Response to PEM Fuel Cell Stack Compressive Load
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This technical brief reports new findings regarding the strong relationship between the temperature of the bipolar plates of a proton exchange membrane fuel cell stack and thermal conditions ...
Ball Grid Array Thermomechanical Response During Reflow Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermomechanical response of ball-grid array assemblies during reflow soldering is considered here. Experiments are performed to investigate the thermomechanical response of a representative ...
Small and Large Time Solutions for Surface Temperature, Surface Heat Flux, and Energy Input in Transient, One-Dimensional Conduction
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper addresses one-dimensional transient conduction in simple geometries. It is well known that the transient thermal responses of various objects, or of an infinite medium surrounding such ...
Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Reflow soldering with nitrogen injection is simulated. Soldering is performed in a process oven that is equipped with porous panel heaters through which air or nitrogen is introduced to the ...
A Detailed Thermal Model of the Infrared Reflow Soldering Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A thermal model of the infrared reflow soldering process is developed and sample predictions are reported. The model, which accounts for coupled radiation, mixed convection and conduction heat ...
Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental study has been conducted to reveal the relevant heat transfer mechanisms which exist within an infrared reflow oven. Simulated card assemblies are used and their transient thermal ...