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    Failure Analysis of Miniature Solder Specimen 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001:;page 100
    Author(s): Y. Wei; H. E. Fang; T. J. Lim; W. Lu; M. K. Neilsen; C. L. Chow
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The effects of specimen geometry size on the behavior of 63Sn-37Pb solder are investigated both experimentally in the laboratory and analytically with finite-element simulations. The simulations ...
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