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RISWirebond Deformation During Molding of IC Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: During the transfer molding of IC packages, wirebonds are deformed by the action of flow-induced viscous forces acting along them. Excessive deformation of wirebonds could give rise to short ...
The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A reliable technique for characterizing the hygroscopic swelling of materials has been developed and used to characterize a number of packaging materials. Using these data, hygroscopic stress ...
Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lamination of poly(tetrafluoroethylene) (PTFE) film to a copper foil or to an epoxy-based print circuit board (PCB) Substrate (FR4®) was carried out. Lamination was achieved during surface ...