Abstract: In this paper, a method based on image analysis is introduced to produce a 3-dimensional picture of a solder joint. This 3-D image gives a detailed view of the solder contour and the fatigue ...

Abstract: Solder alloys are commonly tested with shear tests to study their mechanical properties or low-cycle fatigue performance. In this work, the suitability of various shear tests for quantitative ...

Abstract: This study investigates the effect of quasi-static bending loads (strain rate=0.05/s) on the durability of 0.5 mm pitch Chip Scale Package (CSP) interconnects when assembled on FR4 substrates. ...

Abstract: The effect of underfill material on reliability of flip chip on board (FCOB) assemblies is investigated in this study by using two-dimensional and three-dimensional finite element simulations ...