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RISNondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive ...
A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the general trends in microelectronics packaging is the constant miniaturization of devices. This has led to the development of maximum miniaturization of components on Si level, i.e., ...