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RISPassive Alignment Method for the Bonding of Flat Surfaces Using a Squeeze Flow
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: A method to passively align bonded components without direct mechanical contact has been developed. This method uses the pressure field generated by the squeeze flow between the parts during the bonding process to increase ...
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigated the effect of heat spreading on the boiling of the Novec 649™ for two-phase immersion cooling of electronics. Reference pool boiling tests were performed by attaching a 25.4 mm by 25.4 mm square ...
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a two-phase immersion cooling system, boiling on the spreader surface has been experimentally found to be nonuniform, and it is highly related to the surface temperature and the heat transfer coefficient. An experimentally ...