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RISEffect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The sandwich structure Cu/Sn/Cu solder joints with different thicknesses of the solder layers (δ) are fabricated using a reflow solder method. The microstructure and composition of the solder joints are observed and analyzed ...
Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In electronic packaging, most researchers are mainly focused on the mechanical properties of Cu–Sn intermetallic compounds (IMCs) at room temperature; few studies have looked into the relationship between hardness, elastic ...
Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Cu foam (Cu-F) and Ag-coated Cu-F were added into nano-Ag paste to obtain Cu-F@nano-Ag composite sintered joint. The microstructure, hardness, and shear behavior of the sintered joints were investigated. Experimental results ...