Abstract: Pressure and shear flow factors (Patir and Cheng, 1978) were used to take into account the roughness of the pad surface in the modeling of the interfacial fluid pressure during chemical ...

Abstract: Prior work has shown that there exist a sub-ambient fluid pressure at the interface between a rigid flat and the polishing pad during chemical mechanical polishing (CMP). This sub-ambient fluid ...

Abstract: Previous experimental work has shown that negative fluid pressure does develop at the disk/pad interface during chemical mechanical polishing. However, these studies dealt with one-dimensional ...