Abstract: A simple and physically meaningful analytical (“mathematicalâ€‌) predictive model is developed using twodimensional (planestress) theoryofelasticity approach (TEA) for the evaluation of the effect of the circular ...

Abstract: The objective of this review is twofold: to show materials scientists, mechanical engineers, and reliability physicists not involved in electronics, photonics, microelectronic-mechanical-systems (MEMS), or MOEMS (optical ...

Abstract: A physically meaningful analytical (mathematical) model is developed for the prediction of the interfacial shearing thermal stress in an assembly comprised of two identical components, which are subjected to different ...

Abstract: Broadening the temperature range in accelerated testing of electronic products is a typical measure to assure that the product of interest is sufficiently robust. At the same time, a too broad temperature range can lead ...

Abstract: Lowtemperature thermally induced stresses in a trimaterial assembly subjected to the change in temperature are predicted based on an approximate structural analysis (strengthofmaterials) analytical (“mathematicalâ€‌) ...

Abstract: A simple and easytouse analytical (“mathematicalâ€‌) predictive model has been developed for the assessment of the size of an inelastic zone, if any, in a ballgridarray (BGA) assembly. The BGA material is considered ...