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RISEffect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joints in electronic assemblies are subjected to mechanical and thermal cycling. These cyclic loadings lead to the fatigue failure of solder joints involving damage accumulation, crack initiation, crack propagation, ...
A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods ...