Search
CSV
RISReliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal and mechanical responses of a 304-Pin, 0.5 mm pitch, 40 mm by 40 mm body size plastic quad flat pack (QFP) solder joints and leads have been determined in this study. The thermal ...
Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the advantage of TSOP with copper leads is shown by comparing: (1) the calculated stress and strain in the solder joints with that of the TSOP with Alloy 42 lead frames (Lau ...
Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An exact analysis is presented for the stresses and deflections of circular plates (glass windows) elastically restrained along its edge in a photonic device’s housing subjected to the pressure ...