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RISComparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). ...
Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, a new experimental methodology for analyzing the drop impact response is assessed using a pair of high-speed digital cameras and 3D digital image correlation software. Two different ...
Effect of Shield-Can on Dynamic Response of Board-Level Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In order to protect the electronic components of electronic devices on a printed circuit board (PCB) against electromagnetic radiation, a conductive shield-can or box is normally attached to the ...