Abstract: To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were ...

Abstract: In this paper, the creep and relaxation behaviors of a wafer-level CSP assembly under two types of thermal loading conditions were investigated using high sensitivity moiré interferometry. One ...

Abstract: Equations to predict local intergranular failure (by “r”-type and “wedge”-type cavitation and the coupling between them) have been developed. The derivation has utilized physically based concepts ...

Abstract: This study is to observe the exact behavior of anisotropic conductive adhesion (ACF) package under humid environments by obtaining the moisture-induced properties such as diffusion coefficient ...

Abstract: One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling ...