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    Thermal Stress Analysis for Rapid Thermal Process With Convective Cooling 

    Source: Journal of Manufacturing Science and Engineering:;2005:;volume( 127 ):;issue: 003:;page 564
    Author(s): Shih-Yu Hung; Ching-Kong Chao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A fast temperature ramp of rapid thermal processing (RTP) with convective cooling used to shorten the cooling time for the wafer is presented in this paper. Based on thermal and stress analyses, ...
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    The Effect of Lamps Radius on Thermal Stresses for Rapid Thermal Processing System 

    Source: Journal of Manufacturing Science and Engineering:;2003:;volume( 125 ):;issue: 003:;page 504
    Author(s): Ching-Kong Chao; Cheng-Ching Yu; Shih-Yu Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The concept of rapid thermal processing has many potential applications in microelectronics manufacturing, but the details of chamber design remains an active area of research. In this work the ...
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    Analytical Solutions for Anisotropic Heat Conduction Problems in a Trimaterial With Heat Sources 

    Source: Journal of Heat Transfer:;2010:;volume( 132 ):;issue: 009:;page 91302
    Author(s): Ming-Ho Shen; Fu-Mo Chen; Shih-Yu Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this work, the analytical solution of a fundamental problem of heat conduction in anisotropic medium is derived. The steady-state temperature field in an anisotropic trimaterial subject to ...
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