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    Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers 

    Source: Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 004:;page 41008-1
    Author(s): Shahi, Pardeep; Deshmukh, Apruv Pravin; Hurnekar, Hardik Yashwant; Saini, Satyam; Bansode, Pratik; Kasukurthy, Rajesh; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Transistor density trends till recently have been following Moore's law, doubling every generation resulting in increased power density. The computational performance gains with the breakdown of Moore's law were achieved ...
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    Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41117-1
    Author(s): Shahi, Pardeep; Heydari, Ali; Eslami, Bahareh; Radmard, Vahideh; Hinge, Chandraprakash; Modi, Himanshu; Chinthaparthy, Lochan Sai Reddy; Tradat, Mohammad; Agonafer, Dereje; Rodriguez, Jeremy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ...
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    Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41112-1
    Author(s): Bansode, Pratik; Suthar, Rohit; Bhandari, Rabin; Lakshminarayana, Akshay; Eda, Naga Tejesh; Gupta, Gautam; Simon, Vibin; Modi, Himanshu; Nair, Vivek; Shahi, Pardeep; Saini, Satyam; Sivaraju, Krishna Bhavana; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The data center's server power density and heat generation have increased exponentially because of the recent, unparalleled rise in the processing and storing of massive amounts of data on a regular basis. One-third of the ...
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    Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 24501-1
    Author(s): Saini, Satyam; Shahi, Pardeep; Bansode, Pratik; Shah, Jimil M.; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Continuous rise in cloud computing and other web-based services propelled the data center proliferation seen over the past decade. Traditional data centers use vapor-compression-based cooling units that not only reduce ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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