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RISDesign Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using “virtual prototyping.” Here, a virtual flip chip ball grid array (FC-BGA) is examined in comparison to ...