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Thermal wave imaging of microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal waves can reveal thermal properties of different layers forming a multilayer structure. If the thickness of each layer is known, specific ranges of thermal wave frequencies can be implemented to study the thermal ...
Imaging Thermal Transport in Graphene
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Frequency domain thermoreflectance (FDTR) imaging is used to create quantitative maps of both inplane thermal conductance and crossplane thermal boundary conductance (TBC) for graphene multilayers encased between titanium ...
Thermal Property Imaging of Aluminum Nitride Composites
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Frequency domain thermoreflectance (FDTR) imaging is used to create quantitative thermal conductivity maps of porous Aluminum Nitride (AlN) particles embedded in epoxy. The AlNepoxy composite is polished and coated with a ...
Mapping Thickness Dependent Thermal Conductivity of GaN
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Frequency domain thermoreflectance (FDTR) is used to create quantitative maps of thermal conductivity and thickness for a thinning gallium nitride (GaN) film on silicon carbide (SiC). GaN was grown by molecular beam epitaxy ...