Abstract: No-flow underfill materials reduce assembly processing steps and can potentially be used in fine-pitch flip chip on organic board assemblies. Such no-flow underfills, when filled with nano-scale ...

Abstract: The occurrence of passivation-underfill interfacial delamination is detrimental to the reliability of the flip chip assembly as it can result in the premature cracking of the solder bumps. In ...

Abstract: Flip chip technology is one of the fastest growing segments of electronic packaging with growth being driven by the demands such as cost reduction, increase of input/output density, package ...

Abstract: One of the key challenges in the thermal management of electronic packages are interfaces, such as those between the chip and heat spreader and the interface between a heat spreader and heat ...