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    Use of Silicone Oil and Coconut Oil as Liquid Spectrum Filters for BSPVT: With Emphasis on Degradation of Liquids by Sunlight 

    Source: Journal of Solar Energy Engineering:;2018:;volume( 140 ):;issue: 001
    Author(s): Joshi, Sandeep S.; Dhoble, Ashwinkumar S.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The solar photovoltaic thermal system (PVT) facilitates conversion of incoming solar radiations into heat and electricity simultaneously. The beam split photovoltaic thermal system (BSPVT) is one of the PVT systems. In ...
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    On the Relationship between Mean Monsoon Precipitation and Low Pressure Systems in Climate Model Simulations 

    Source: Journal of Climate:;2015:;volume( 028 ):;issue: 013:;page 5305
    Author(s): Praveen, V.; Sandeep, S.; Ajayamohan, R. S.
    Publisher: American Meteorological Society
    Abstract: he north-northwest-propagating low pressure systems (LPS) are an important component of the Indian summer monsoon (ISM). The objective detection and tracking of LPS in reanalysis products and climate model simulations are ...
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    A Novel Finite-Element– Numerical-Integration Model for Composite Laminates Supported on Opposite Edges 

    Source: Journal of Applied Mechanics:;2007:;volume( 074 ):;issue: 006:;page 1114
    Author(s): Tarun Kant; Sandeep S. Pendhari; Yogesh M. Desai
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An attempt is made here to devise a new methodology for an integrated stress analysis of laminated composite plates wherein both in-plane and transverse stresses are evaluated simultaneously. ...
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    A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004:;page 305
    Author(s): Sandeep S. Tonapi; Sanjeev B. Sathe; Bahgat G. Sammakia; K. Srihari
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages ...
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