Abstract: Slicing of Si wafers through abrasive processes generates various surface defects on wafers such as cracks and surface contaminations. Also, the processes cause a significant material loss during slicing and subsequent ...

Abstract: In this paper, the effect of porosity on the ductility of as-cast AA7075 (a commercial high-strength aluminum alloy) was investigated. The as-cast material was processed through hot upsetting, and specimens with different ...