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    Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 24501-1
    Author(s): Saini, Satyam; Shahi, Pardeep; Bansode, Pratik; Shah, Jimil M.; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Continuous rise in cloud computing and other web-based services propelled the data center proliferation seen over the past decade. Traditional data centers use vapor-compression-based cooling units that not only reduce ...
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    Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers 

    Source: Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 004:;page 41008-1
    Author(s): Shahi, Pardeep; Deshmukh, Apruv Pravin; Hurnekar, Hardik Yashwant; Saini, Satyam; Bansode, Pratik; Kasukurthy, Rajesh; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Transistor density trends till recently have been following Moore's law, doubling every generation resulting in increased power density. The computational performance gains with the breakdown of Moore's law were achieved ...
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    Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling 

    Source: Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 002:;page 21109-1
    Author(s): Shah, Jimil M.; Padmanaban, Keerthivasan; Singh, Hrishabh; Duraisamy Asokan, Surya; Saini, Satyam; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The adoption of single-phase liquid immersion cooling (Sp-LIC) for Information Technology equipment provides an excellent cooling platform coupled with significant energy savings. There are, however, very limited studies ...
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    Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41112-1
    Author(s): Bansode, Pratik; Suthar, Rohit; Bhandari, Rabin; Lakshminarayana, Akshay; Eda, Naga Tejesh; Gupta, Gautam; Simon, Vibin; Modi, Himanshu; Nair, Vivek; Shahi, Pardeep; Saini, Satyam; Sivaraju, Krishna Bhavana; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The data center's server power density and heat generation have increased exponentially because of the recent, unparalleled rise in the processing and storing of massive amounts of data on a regular basis. One-third of the ...
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    Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041103-1
    Author(s): Shah, Jimil M.; Anand, Roshan; Singh, Prabjit; Saini, Satyam; Cyriac, Rawhan; Agonafer, Dereje; Kaler, Mike
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A remarkable amount of energy in data centers is consumed in eliminating the heat generated by the information technology (IT) equipment to maintain and ensure safe operating conditions and optimum performance. The ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian