Abstract: Efficient modeling strategies are developed to study thermomechanical durability of high I/O Ball Grid Array (BGA) packages, in order to facilitate virtual qualification and accelerated testing ...

Abstract: This study investigates the effect of quasi-static bending loads (strain rate=0.05/s) on the durability of 0.5 mm pitch Chip Scale Package (CSP) interconnects when assembled on FR4 substrates. ...

Abstract: The effect of underfill material on reliability of flip chip on board (FCOB) assemblies is investigated in this study by using two-dimensional and three-dimensional finite element simulations ...