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    The Thermal Wake Function for Rectangular Electronic Modules 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001:;page 55
    Author(s): S. S. Kang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A point heat source model is employed to study the thermal wake function for an array of rectangular electronic modules situated in a uniform flow stream. For the particular case of in-line ...
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