Abstract: This work focuses on the interpretation of experimental results obtained from fracture toughness tests conducted for a typical metal/polymer bimaterial interface similar to those encountered in ...

Abstract: The thermomechanical behavior of a new multilayered substrate with embedded passive components is the focus of this study. Such structures are typically susceptible to localized interfacial stresses ...

Abstract: Large area substrate processing is a key solution for improving the productivity of multi-chip module deposition (MCM-D) technology. This project is focused on high temperature low modulus polymeric ...