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Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A three-dimensional mathematical model simulating the self-alignment mechanism in the flip-chip soldering of a single joint has been developed. Based on the principle of energy minimization, it ...
Quantitative Characterization of a Flip-Chip Solder Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Based on an energy minimization principle, a mathematical/numerical model has been developed to study the impact of design and process variations associated with flip-chip solder joint on its ...