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Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The results of this study demonstrate the viability of a low cost maskless process for the fabrication of ultra-fine pitch solder bumps. The fabricated solder bump arrays have a pitch and ...
Dynamics and Speed Control of Instrumented Pipeline Inspection Gauge in Gas Pipelines
Publisher: American Society of Civil Engineers
Abstract: Instrumented pipeline inspection gauges (IPIGs) are used to carry out in-line inspection of the pipelines transporting petroleum cargo. The inspection of the pipelines carrying high-speed gas needs the speed of the tool ...