Abstract: The reliability of 0.5 mm pitch, 28-Pin Thin Small Outline Package (TSOP) solder joints has been studied by experimental temperature cycling and a cost-effective 3-D nonlinear finite element ...

Abstract: Thermal stresses and strains in the solder joints and plated-through-hole (PTH) copper pads/barrels of a pin-grid array (PGA) assembly under thermal cycling conditions have been determined in the ...

Abstract: Printed circuit boards populated with twenty-five 0.4 mm pitch, 256-pin plastic quad flat packs (QFP) containing no-clean and water-clean solder joints were subjected to thermal cycling in order ...

Abstract: The solder joint reliability of five different surface mount connectors has been studied by eleven different experimental methods. A set of test methods and specifications for determining the ...