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RISExperimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the primary advantages of surface mount technology (SMT) over through-hole technology is that SMT allows the assembly of components on both sides of the printed circuit board (PCB). ...
Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) packages are of considerable interest at the present time as a means for heterogeneous high-performance integration of disparate digital, analog, optical, and MEMS technologies. ...