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RISShorter Field Life in Power Cycling for Organic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The importance of power cycling as a mean of reliability assessment was revisited for flip chip plastic ball grid array (FC-PBGA) packages. Conventionally, reliability was addressed empirically ...
Minimizing Stress Levels in Piezoelectric Media Containing Elliptical Voids
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper we present an analytical solution to calculate the stress concentrations around an elliptical void in a piezoelectric medium subjected to electrical loading. We show that the ...
Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). ...
Measuring Strain Distribution During Mesoscopic Domain Reorientation in a Ferroelectric Material
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present the results of an experimental study focused on understanding the strain concentrations arising due to nonlinear phenomena associated with polarization switching. A moire ...
Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, a new experimental methodology for analyzing the drop impact response is assessed using a pair of high-speed digital cameras and 3D digital image correlation software. Two different ...